Semiconductors

Currently the majority of high-end processors are monolithic, but design methodologies are slowly but surely shifting to multi-chiplet modules as leading-edge fabrication technologies get more expensive to use. In the coming years multi-chiplet system-in-packages (SiPs) are expected to become much more widespread, and advanced 2.5D and 3D chip packaging technologies will gain importance. To accelerate and simplify development of 3D designs, TSMC this week established its 3DFabric Alliance. While multi-chiplet SiPs promise to simplify development and verification of highly complex designs, they require brand-new development methodologies as 3D packages bring a number of new challenges. This includes new design flows required for 3D integration, new methods of power delivery, new packaging technologies, and new testing techniques. To make the best use of the benefits of...

Samsung Foundry Updates: 7nm EUV, 10LPP, and 14LPC

Earlier this week, Samsung announced a number of updates on the foundry side of their business. While process technology might not be necessarily as interesting as the actual end...

54 by Joshua Ho on 4/22/2016

EUV Lithography Makes Good Progress, Still Not Ready for Prime Time

At the recent annual SPIE Advanced Lithography conference, Intel, TSMC and other leading semiconductor companies said that significant strides have been made in extreme ultraviolet lithography (EUVL) over the...

38 by Anton Shilov on 3/10/2016

Samsung Announces Second-Gen 14nm Low Power Plus (14LPP) Process Now In Mass Production

Today Samsung Semiconductor officialy announces mass production for its second generation 14nm FinFET manufacturing node. Early last year we saw Samsung announce mass production of its first generation FinFET...

32 by Andrei Frumusanu on 1/14/2016

The Samsung Exynos 7420 Deep Dive - Inside A Modern 14nm SoC

Over the past few years it’s been somewhat expected tradition for Samsung Electronics to employ a strategy of multi-sourcing the SoC for their mobile devices. Most notably it’s on...

114 by Andrei Frumusanu on 6/29/2015

Nantero Exits Stealth: Using Carbon Nanotubes for Non-Volatile Memory with DRAM Performance & Unlimited Endurance

The race for next generation non-volatile memory technology is already on at full throttle. We covered Crossbar’s ReRAM announcement last year and last week a very exciting company with...

35 by Kristian Vättö on 6/11/2015

Avago Acquires Broadcom Corporation For $37 Billion

Today Avago Technologies announced their acquisition of Broadcom for 17 billion dollars in cash and 20 billion dollars worth of Avago shares. This will leave Broadcom shareholders with 32%...

33 by Brandon Chester on 5/28/2015

GlobalFoundries Acquires IBM’s Semiconductor Manufacturing Business; IBM Bows Out

The history of the semiconductor manufacturing business is both a story of great success and great failure. On the one hand semiconductor manufacturing has allowed the creation of devices...

31 by Ryan Smith on 10/20/2014

An Introduction to Semiconductor Physics, Technology, and Industry

Learning about semiconductor physics and technology can be a daunting task. While it’s easy enough to understand what a transistor does and some of the terminology thrown around, getting...

77 by Joshua Ho on 10/9/2014

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