Semiconductors

Arm and Samsung this week announced their joint design-technology co-optimization (DTCO) program for Arm's next-generation Cortex general-purpose CPU cores as well as Samsung's next-generation process technology featuring gate-all-around (GAA) multi-bridge-channel field-effect transistors (MBCFETs). "Optimizing Cortex-X and Cortex-A processors on the latest Samsung process node underscores our shared vision to redefine what’s possible in mobile computing, and we look forward to continuing to push boundaries to meet the relentless performance and efficiency demands of the AI era," said Chris Bergey, SVP and GM, Client Business at Arm. Under the program, the companies aim to deliver tailored versions of Cortex-A and Cortex-X cores made on Samsung's 2 nm-class process technology for various applications, including smartphones, datacenters, infrastructure, and various customized system-on-chips. For now, the companies does not...

Intel Submits Ireland Fab Expansion Plan: $8 Billion Price Tag, With a 4 Year Lead Time

Intel has submitted a proposal to Irish authorities for the expansion of its manufacturing site near Leixlip. According to the plans, Intel is exploring the construction of a brand-new...

27 by Anton Shilov on 2/13/2019

SMIC To Start 14nm Mass Production in H1 2019

Reports have emerged this week that SMIC, the largest foundry in China, is set to start mass production using its in-house developed 14 nm FinFET manufacturing technology in the...

20 by Anton Shilov on 2/8/2019

Intel Details Plans for Its Oregon Fab Expansion: D1X Phase 3

Intel this week revealed the first details concerning its fab expansion plans in Oregon. As it turns out, the company intends to build the third phase of its D1X...

26 by Anton Shilov on 2/5/2019

GlobalFoundries to Sell 200-mm Fab 3E to Vanguard, Exits MEMS Business

GlobalFoundries announced on Thursday that it had agreed to sell its Fab 3E in Singapore to Vanguard International Semiconductor (VIS) as part of a broader plan to exit the...

34 by Anton Shilov on 2/1/2019

AMD Amends Wafer Supply Agreement with GlobalFoundries: 7nm Freed, 12nm+ Targets Set Through 2021

AMD on Tuesday said it had amended its wafer supply agreement with GlobalFoundries. Under the terms of the new deal, the two companies agreed about prices and volumes of...

37 by Anton Shilov on 1/29/2019

Intel Considers $11 Billion Fab in Israel

Late last year Intel announced massive plans to increase its global chip production capacities by upgrading, expanding, and equipping four of its fabs. As it turns out, the company...

37 by Anton Shilov on 1/29/2019

TSMC Chip Yields Hit By Bad Chemical Batch

TSMC on Monday said that some of the wafers it has processed recently have lower yields because of a chemical it uses during production. The company began investigation and...

28 by Anton Shilov on 1/29/2019

ASML to Ship 30 EUV Scanners in 2019: Faster EUV Tools Coming

ASML said last week that it planned to ship 30 extreme ultraviolet scanners in 2019, up significantly from 2018. The plan is not surprising, as demand for EUV lithography...

17 by Anton Shilov on 1/28/2019

ASML, Carl Zeiss, and Nikon to Settle Legal Disputes Over Immersion Lithography

Embroiled for some time now in legal disputes concerning immersion lithography, ASML, Carl Zeiss, and Nikon, this week signed a memorandum of understanding relating to a plan to once...

10 by Anton Shilov on 1/25/2019

TSMC: 7nm Now Biggest Share of Revenue

As process node technology gets ever more complex, it costs big dollars to develop and then building chips on the process is also a very costly process. The big...

44 by Ian Cutress on 1/17/2019

Israeli Parliament Approves Intel Fab 28 Expansion Grant

The Finance Committee in Israeli parliament this week approved a grant to Intel to expand its Fab 28 production facility in Kiryat Gat. The decision confirms that Intel’s expansion...

24 by Anton Shilov on 12/28/2018

IBM to use Samsung 7nm EUV for Next-Gen POWER and z CPUs

IBM has announced it has signed an agreement with Samsung Foundry to produce its next-generation processors. This includes processors for IBM Power Systems, IBM z, and LinuxONE systems, all...

24 by Anton Shilov on 12/21/2018

Intel to Expand Production Capacities at Multiple Fabs

Intel this week reiterated plans to expand its production capacities in a bid to more quickly respond to increased demand. In the coming years the company intends to increase...

24 by Anton Shilov on 12/19/2018

Intel Further Boosts CapEx to Meet Demand for 14nm Chips

Earlier this year Intel said that it had reaffirmed its plan to invest $1 billion in a bid to increase the number of chips made using its 14 nm...

21 by Anton Shilov on 12/6/2018

Intel: EUV-Enabled 7nm Process Tech is on Track

Originally planned to enter mass production in the second half of 2016, Intel’s 10 nm process technology is still barely used by the company today. Currently the process is...

79 by Anton Shilov on 12/6/2018

GlobalFoundries and Chinese Authorities Reconsider Plans

Because of its renewed focus on specialized process technologies and competition, GlobalFoundries has opted to reconsider its plans concerning its Fab 11 located near Chengdu, China. Rather than offer...

21 by Anton Shilov on 11/26/2018

GlobalFoundries Establishes Avera Semiconductor: a Custom Chip Company

GlobalFoundries this week announced that it has spun off its ASIC Solutions division, establishing Avera Semiconductor, a wholly owned subsidiary that will help fabless chip developers to design their...

11 by Anton Shilov on 11/2/2018

Samsung Starts Mass Production of Chips Using Its 7nm EUV Process Tech

Samsung Foundry on Wednesday said that it had started production of chips using its 7LPP manufacturing technology that uses extreme ultraviolet lithography (EUVL) for select layers. The new fabrication...

42 by Billy Tallis & Anton Shilov on 10/17/2018

TSMC: First 7nm EUV Chips Taped Out, 5nm Risk Production in Q2 2019

Last week, TSMC made two important announcements concerning its progress with extreme ultraviolet lithography (EUVL). First up, the company has successfully taped out its first customer chip using its...

50 by Anton Shilov on 10/9/2018

GlobalFoundries Enables Connectivity IP: New RF SOI and Ensigma BLE on 22FDX

GlobalFoundries this week made two important announcements concerning its radio and connectivity-related capabilities. First up, the company said that Imagination’s Ensigma connectivity IP is now available for its 22FDX...

2 by Anton Shilov on 9/27/2018

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