Semiconductors

Currently the majority of high-end processors are monolithic, but design methodologies are slowly but surely shifting to multi-chiplet modules as leading-edge fabrication technologies get more expensive to use. In the coming years multi-chiplet system-in-packages (SiPs) are expected to become much more widespread, and advanced 2.5D and 3D chip packaging technologies will gain importance. To accelerate and simplify development of 3D designs, TSMC this week established its 3DFabric Alliance. While multi-chiplet SiPs promise to simplify development and verification of highly complex designs, they require brand-new development methodologies as 3D packages bring a number of new challenges. This includes new design flows required for 3D integration, new methods of power delivery, new packaging technologies, and new testing techniques. To make the best use of the benefits of...

GlobalFoundries Stops All 7nm Development: Opts To Focus on Specialized Processes

GlobalFoundries on Monday announced an important strategy shift. The contract maker of semiconductors decided to cease development of bleeding edge manufacturing technologies and stop all work on its 7LP...

127 by Anton Shilov & Ian Cutress on 8/27/2018

Hot Chips 2018: Xilinx DNN Processors Live Blog

Xilinx has several talks this year at Hot Chips, and aside from the ACAP earlier in the day, the talk about their Deep Neural Network processor also looks interesting...

3 by Ian Cutress on 8/21/2018

Hot Chips 2018: Going Deep on NVSwitch Live Blog (8:45am PT, 3:45pm UTC)

The first talk on Day 2 of Hot Chips is from NVIDIA, going into more detail about how the NVSwitch works with a lot more detail than from previous...

2 by Ian Cutress on 8/21/2018

TSMC: Outbreak of Malware That Triggered Delays & Losses Caused by Software for New Tool

TSMC announced this week that it suffered a computer malware outbreak, resulting in a roughly 3 day outage for parts of the fab while systems were restored. As a...

42 by Anton Shilov on 8/9/2018

MRAM Developer Day, GlobalFoundries Keynote Live Blog

Second Keynote today is from GlobalFoundries, Everspin's MRAM partner.

1 by Ian Cutress on 8/6/2018

ASML Ships Twinscan NXT:2000i Scanner for 7nm and 5nm DUV

ASML, the company known for producing equipment for the manufacture of processors and semiconductors at foundries, has started to ship its new Twinscan NXT:2000i DUV (Deep Ultra Violet) scanner...

15 by Anton Shilov on 8/2/2018

SK Hynix Set to Build a New Memory Fab

SK Hynix last week announced plans to build another semiconductor fab near its headquarters in Icheon, South Korea. The production facility is not going to be as big and...

16 by Anton Shilov on 7/30/2018

Intel Provides Royalty-Free License for Data Bus to DARPA’s Modular Chips Initiative

Taking place this week is DARPA’s 2018 Electronic Resurgence Initiative (ERI) Summit, the defense research agency's first gathering to address the direction of US technology manufacturing as Moore's Law...

14 by Anton Shilov on 7/25/2018

GlobalFoundries Announces 22FDX Milestone: $2 Billion in Design Wins

GlobalFoundries on Monday announced a milestone concerning its 22FDX-branded fully-depleted SOI low-power planar transistor platform. The company initiated volume production using the technology with yields and performance meeting expectations...

13 by Anton Shilov on 7/10/2018

Arm and Samsung Extend Artisan POP IP Collaboration to 7LPP and 5LPE Nodes

Arm and Samsung Foundry this week announced plans to extend their collaboration to 7LPP and 5LPE process technologies. Under the terms of the agreement, Arm will offer Samsung Foundry...

23 by Anton Shilov on 7/6/2018

UMC Acquires Fujitsu’s Stake in Semiconductor Joint Venture

Fujitsu Semiconductor and UMC on Friday said that the latter will acquire 100% ownership of Mie Fujitsu Semiconductor (MIFS), a joint venture between two companies. The move essentially ends...

2 by Anton Shilov on 6/29/2018

Samsung to Pay $400 Million for Infringing FinFET Patent

A federal jury in Texas ordered Samsung Electronics to pay $400 million to a South Korean university for infringing one of fundamental patents related to double gate FinFET transistors...

33 by Anton Shilov on 6/19/2018

GlobalFoundries Gives 7 nm Capacity Update, Mulls Skipping 5 nm

High-ranking executives of GlobalFoundries this month gave several updates concerning future plans of the contract maker of semiconductors. As it appears, in a bid to provide more tangible advantages...

19 by Anton Shilov on 5/31/2018

Samsung Foundry Roadmap: EUV-Based 7LPP for 2018, 3 nm Incoming

Samsung Foundry this week updated its fabrication technology roadmap, introducing a number of changes and announcing the first details about its 3 nm manufacturing process that is several years...

25 by Anton Shilov on 5/24/2018

Intel Discloses Plans to Spend $5 Billion on Fab 28 Expansion in Israel

Intel and two Israeli ministries this week announced that the chip giant plans to invest $5 billion in its Kiryat Gat fab complex – Fab 28 – through 2020...

35 by Anton Shilov on 5/18/2018

TSMC Details 5 nm Process Tech: Aggressive Scaling, But Thin Power and Performance Gains

At a special event last week, TSMC announced the first details about its 5 nm manufacturing technology that it plans to use sometime in 2020. CLN5 will be the...

10 by Anton Shilov on 5/8/2018

Intel Delays Mass Production of 10 nm CPUs to 2019

Intel on Thursday announced that it would delay mass production of its 10 nm processors from 2018 to 2019 due to yield issues. The company has claimed to be...

156 by Anton Shilov on 4/27/2018

TSMC Kicks Off Volume Production of 7nm Chips

TSMC last week announced that it had started high volume production (HVM) of chips using their first-gen 7 nm (CLN7FF) process technology. The contract maker of semiconductors says it...

63 by Anton Shilov on 4/24/2018

Cadence Announces Tensilica Vision Q6 DSP

Today’s announcement comes from Cadence, and we see the unveiling of a new DSP IP called the new Tensilica Vision Q6. The Q6 succeeds the Vision P6 which as...

20 by Andrei Frumusanu on 4/11/2018

Change of Strategy: A New GlobalFoundries CEO in Dr. Thomas Caulfield

In a surprising move, GlobalFoundries has announced that its CEO is stepping down. Sanjay Jha, who lead the world’s second largest foundry for four years, was in the past...

15 by Anton Shilov on 3/15/2018

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