GlobalFoundries Press Release

GlobalFoundries Reshapes Technology Portfolio to Intensify Focus on Growing Demand for Differentiated Offerings

Semiconductor manufacturer realigns leading-edge roadmap to meet client need and establishes wholly-owned subsidiary to design custom ASICs.

Santa Clara, Calif., August 27, 2018 – GLOBALFOUNDRIES today announced an important step in its transformation, continuing the trajectory launched with the appointment of Tom Caulfield as CEO earlier this year. In line with the strategic direction Caulfield has articulated, GF is reshaping its technology portfolio to intensify its focus on delivering truly differentiated offerings for clients in high-growth markets.

GF is realigning its leading-edge FinFET roadmap to serve the next wave of clients that will adopt the technology in the coming years. The company will shift development resources to make its 14/12nm FinFET platform more relevant to these clients, delivering a range of innovative IP and features including RF, embedded memory, low power and more. To support this transition, GF is putting its 7nm FinFET program on hold indefinitely and restructuring its research and development teams to support its enhanced portfolio initiatives. This will require a workforce reduction, however a significant number of top technologists will be redeployed on 14/12nm FinFET derivatives and other differentiated offerings.

“Demand for semiconductors has never been higher, and clients are asking us to play an ever-increasing role in enabling tomorrow’s technology innovations,” Caulfield said. “The vast majority of today’s fabless customers are looking to get more value out of each technology generation to leverage the substantial investments required to design into each technology node. Essentially, these nodes are transitioning to design platforms serving multiple waves of applications, giving each node greater longevity. This industry dynamic has resulted in fewer fabless clients designing into the outer limits of Moore’s Law. We are shifting our resources and focus by doubling down on our investments in differentiated technologies across our entire portfolio that are most relevant to our clients in growing market segments.”

In addition, to better leverage GF’s strong heritage and significant investments in ASIC design and IP, the company is establishing its ASIC business as a wholly-owned subsidiary, independent from the foundry business. A relevant ASIC business requires continued access to leading-edge technology. This independent ASIC entity will provide clients with access to alternative foundry options at 7nm and beyond, while allowing the ASIC business to engage with a broader set of clients, especially the growing number of systems companies that need ASIC capabilities and more manufacturing scale than GF can provide alone.

GF is intensifying investment in areas where it has clear differentiation and adds true value for clients, with an emphasis on delivering feature-rich offerings across its portfolio. This includes continued focus on its FDXTM platform, leading RF offerings (including RF SOI and high-performance SiGe), analog/mixed signal, and other technologies designed for a growing number of applications that require low power, real-time connectivity, and on-board intelligence. GF is uniquely positioned to serve this burgeoning market for “connected intelligence,” with strong demand in new areas such as autonomous driving, IoT and the global transition to 5G.

What’s Next for GlobalFoundries?
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  • DanNeely - Monday, August 27, 2018 - link

    Will IBMs huge mainframe chips be one of the specialized products they'll still be supporting, or is big blue being unceremoniously dumped in a ditch and left to scramble to migrate their chip designs to either a Samsung or TSMC process?
  • Ian Cutress - Monday, August 27, 2018 - link

    Technically the IBM contract runs out end of the year. Beyond that, not sure.
  • Alexvrb - Tuesday, August 28, 2018 - link

    I'm sure they'll continue working with IBM for the foreseeable future. But that still revolves around 14HP, I'd bet.
  • FunBunny2 - Tuesday, August 28, 2018 - link

    according to the wiki (no, I didn't run the links :) ) the Z14 is a 6.1 billion chip. not, by any means, the highest transistor count among cpu. not the biggest, but big, by area either.
    here: https://en.wikipedia.org/wiki/Transistor_count#Mic...
  • name99 - Tuesday, August 28, 2018 - link

    Look at what Intel has done with 14nm, +, ++, etc.
    There's a lot of optimization left in leading edge hardware for the obvious reason that you're always time constrained -- you do things the safe way, you drop ideas that don't fit the schedule, and so on.
    IBM can certainly cruise for a few years (with both POWER and z) on just optimizing what they have at the µArchitecture and system level, sticking with GloFo's 14nm (which will doubtless pick up small improvements at the process level each year); looking at how they can exploit advanced packing (ie things like interposers or EMIB) and advanced memories (MRAM, Nantero, Optane, ...).

    That's not an ideal on-going situation, but it's absolutely feasible for a few years as the market sorts itself out and GloFo figures out its future.
    Maybe GloFo partners with UMC?
    Maybe they license Samsung's 7nm as soon as ASML can make enough machines?
    Maybe they conclude that the economics (for their set of clients) works best not by standing still at 14nm, but if they are always about three years behind the absolute leading edge?
  • Dragonrider - Saturday, September 1, 2018 - link

    Then again, IBM just might get Intel to build their stuff. Stranger things have happened.
  • klagermkii - Monday, August 27, 2018 - link

    If this means that AMD will no longer pay penalties to fab their chips at competent leading-edge foundries, then this is fantastic news, and Global Foundries can go climb into the rubbish bin of silicon history.
  • CajunArson - Monday, August 27, 2018 - link

    This clearly means that 5nm is so far ahead of schedule that GloFo will have it out in January!

    Because advanced lithography is SUPER EASY for literally everybody but those idiots at Intel.

    Right! Right???
  • rahvin - Monday, August 27, 2018 - link

    Didn't read the article did you? GloFo is abandoning the market because they don't believe they can compete economically against Samsung and TSMC. Basically the EUV fabs cost $20 billion and to afford that you need to produce more modules than GloFo physically can. As a result they are going to start fabbing specialized chips (probably ASICs and others) on their existing process and let TSMC and Samsung have the market.
  • phoenix_rizzen - Monday, August 27, 2018 - link

    <Whoosh>

    The sound of sarcasm flying over your head. :)

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