SoCs

As part of Apple’s spring “Peek Performance” product event this morning, Apple unveiled the fourth and final member of the M1 family of Apple Silicon SoCs, the M1 Ultra. Aimed squarely at desktops – specifically, Apple’s new Mac Studio – the M1 Ultra finds Apple once again upping the ante in terms of SoC performance for both CPU and GPU workloads. And in the process, Apple has thrown the industry a fresh curveball by not just combining two M1 Max dies into a single chip package, but by making the two dies present themselves as a single, monolithic GPU, marking yet another first for the chipmaking industry. Back when Apple announced the M1 Pro and the already ridiculously powerful M1 Max last fall, we figured...

Arm Announces Cortex-M55 Core And Ethos-U55 microNPU

Today Arm announces its newest addition to the Cortex-M series, the new Cortex M55. In addition to the new CPU microarchitecture which brings several new improvements, we also see...

16 by Andrei Frumusanu on 2/10/2020

Intel Joins CHIPS Alliance, Contributes Advanced Interface Bus

Intel this week became a member of CHIPS Alliance, an industry consortium that is working to accelerate the development of open source SoCs (and SiPs) for various applications. As...

17 by Anton Shilov on 1/24/2020

CES 2020: Ambarella Showcases CV2, CV22 and CV25 Demos

Amongst the many showcases at CES 2020 was Ambarella’s newest demo line-up showcasing various solutions using the CV2, CV22 and also demonstrating new platforms based on the newly announced...

13 by Andrei Frumusanu on 1/16/2020

CES 2020: MediaTek Announces New Dimensity 800 Mid-Range 5G SoC

Today MediaTek has announced a new entry into its new “Dimensity” 5G SoC product lineup. The new chip is called the Dimensity 800 and represents a mid-range solution for...

12 by Andrei Frumusanu on 1/7/2020

Imagination and Apple Renew IP Licensing Agreement

Today Imagination Technologies has announced that Apple has signed a new multi-year licensing with the company, giving the Cupertino company continued access to Imagination’s IP.

27 by Andrei Frumusanu on 1/2/2020

Samsung Kicks Off Mass Production of AI Chip for Baidu: 260 TOPS at 150 W

Samsung Foundry and Baidu this week said that the companies were about to start mass production of an AI accelerator chip early in 2020. Baidu’s Kunlun chip is to...

9 by Anton Shilov on 12/18/2019

NVIDIA Details DRIVE AGX Orin: A Herculean Arm Automotive SoC For 2022

While NVIDIA’s SoC efforts haven’t gone entirely to plan since the company first started on them over a decade ago, NVIDIA has been able to find a niche that...

33 by Ryan Smith on 12/18/2019

Qualcomm Windows on Snapdragon: New 7c & 8c SoCs for sub-$800 Laptops

Last year Qualcomm introduced its flagship Snapdragon 8cx platform for premium always-connected PCs (ACPCs) that packed the best technologies that the company had to offer at the time. Being...

54 by Anton Shilov on 12/6/2019

Qualcomm Announces Snapdragon 865 and 765(G): 5G For All in 2020, All The Details

We’re here in Maui for the second day of Qualcomm’s fourth annual Snapdragon summit, for what is probably the most exciting part of the event, as we cover the...

91 by Andrei Frumusanu on 12/4/2019

Qualcomm Snapdragon Tech Summit Live Blog: Day One

Today is the start of Qualcomm's three-day annual Snapdragon Tech Summit. Day one historically is where Qualcomm goes into detail about how the company is performing, and this year...

20 by Dr. Ian Cutress on 12/3/2019

Imagination Announces A-Series GPU Architecture: "Most Important Launch in 15 Years"

There are very few companies in the world able to claim a history in the graphics market dating back to the “golden age” of the 90’s. Among the handful...

143 by Andrei Frumusanu on 12/2/2019

MediaTek Announces Dimensity 1000 SoC: Back To The High-End With 5G

Today MediaTek is announcing the new Dimensity 1000 SoC – the company’s new 5G flagship SoC for 2019 and early 2020. The announcement really isn’t too much of a...

42 by Andrei Frumusanu on 11/26/2019

NUVIA: New Server CPU Startup Going After Intel and AMD

Founded by former senior Apple CPU architects, NUVIA for the first time publicly revealed its existence with the announcement of a successful first investment round. The company broke cover...

41 by Andrei Frumusanu on 11/15/2019

MLPerf Releases Official Results For First Machine Learning Inference Benchmark

Since launching their organization early last year, the MLPerf group has been slowly and steadily building up the scope and the scale of their machine learning benchmarks. Intending to...

12 by Ryan Smith on 11/6/2019

Samsung Confirms Custom CPU Development Cancellation

The fate of Samsung's custom CPU development efforts has been making the rounds of the rumour mill for almost a month, and now we finally have confirmation from Samsung...

42 by Andrei Frumusanu on 11/4/2019

x86 PC Smaller than an iPhone: GIGABYTE's GA-PICO3350 with an Apollo Lake CPU

Hidden underneath the mass of news is a new small Pico-ITX based SoC motherboard from GIGABYTE, the GA-PICO3350. Smaller than the latest iPhone 11 smartphone, the GIGABYTE GA-PICO3350 is...

14 by Gavin Bonshor on 10/24/2019

CEVA Announces NeuPro-S Second-Generation NN IP

It’s been a few years since machine learning and neural networks first started to be the hot new news topic. Ever since then, the market has transformed a lot...

5 by Andrei Frumusanu on 9/17/2019

Huawei Announces Kirin 990 and Kirin 990 5G: Dual SoC Approach, Integrated 5G Modem

For the last 3 years, Huawei has announced its next generation SoC at the IFA technology show here in Berlin. In every occasion, the company promotes its hardware, using...

153 by Dr. Ian Cutress on 9/6/2019

Samsung Announces Exynos 980 - Mid-Range With Integrated 5G Modem

In a surprise announcement, Samsung today unveiled their very first SoC with integrated 5G connectivity. The new chipset isn’t a flagship follow-up to the Exynos 9825 and 9820, but...

20 by Andrei Frumusanu on 9/4/2019

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon

The final presentation of Hot Chips 31 is from Microsoft, who will be lifting the lid of the silicon behind its HoloLens 2.0 product.

9 by Dr. Ian Cutress on 8/20/2019

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