Semiconductors

Currently the majority of high-end processors are monolithic, but design methodologies are slowly but surely shifting to multi-chiplet modules as leading-edge fabrication technologies get more expensive to use. In the coming years multi-chiplet system-in-packages (SiPs) are expected to become much more widespread, and advanced 2.5D and 3D chip packaging technologies will gain importance. To accelerate and simplify development of 3D designs, TSMC this week established its 3DFabric Alliance. While multi-chiplet SiPs promise to simplify development and verification of highly complex designs, they require brand-new development methodologies as 3D packages bring a number of new challenges. This includes new design flows required for 3D integration, new methods of power delivery, new packaging technologies, and new testing techniques. To make the best use of the benefits of...

Sony to Build New Fab to Boost CMOS Sensor Output

Sony this week has revealed that the company will be building a new semiconductor fab to boost output of its CMOS sensors, as part of a broader effort to...

16 by Anton Shilov on 11/1/2019

GlobalFoundries and TSMC Sign Broad Cross-Licensing Agreement, Dismiss Lawsuits

GlobalFoundries and TSMC have announced this afternoon that they have signed a broad cross-licensing agreement, ending all of their ongoing legal disputes. Under the terms of the deal, the...

27 by Anton Shilov on 10/28/2019

Intel Files Antitrust Suit Against SoftBank-Controlled Firm Over Patent Aggregation

Intel this week filed an lawsuit against Fortress Investment Group, a patent assertion entity controlled by SoftBank. Responding to a series of patent infringement lawsuits that Fortress has brought...

21 by Anton Shilov on 10/23/2019

TSMC: 5nm on Track for Q2 2020 HVM, Will Ramp Faster Than 7nm

TSMC’s 5 nm (N5) manufacturing technology is projected to provide significant benefits when it comes to performance, power, and area scaling, which is why the contract maker of semiconductors...

27 by Anton Shilov on 10/23/2019

New Tools Simplify Development of 2.5D Multi-Die 7nm Designs at Samsung Foundry

Advanced packaging technologies simplify production and increase performance of highly-complex multi-die SoCs as the semiconductor industry is looking at chiplet approach as an alternative to large dies that take...

5 by Anton Shilov on 10/22/2019

TSMC Radically Boosts CapEx to Expand Production Capacities, To Reach $14B For 2019

Forecasting strong demand for its 5 nm and 7 nm class process technologies in the coming years, TSMC has announced that it's increasing its capital expenditure for 2019 by...

18 by Anton Shilov on 10/18/2019

EUV Demand is Up: EUV Device Manufacturer ASML Beats Sales Estimates

Between the smartphone revolution, cloud computing, and the Internet of Things, the demand for cutting-edge chips has never been higher. And if you have any doubts about that, then...

46 by Anton Shilov on 10/16/2019

Samsung & TSMC Develop 8nm & 7nm Automotive-Grade Nodes

As vehicles are getting ‘smarter’ and gaining autopilot capabilities, it is easy to predict that the demand for higher-performing and more complex automotive SoCs will be growing rapidly in...

29 by Anton Shilov on 10/14/2019

New Tools & IP Accelerate Development of 5nm Arm ‘Hercules’ SoCs

Arm, Synopsys, and Samsung Foundry have developed a set of optimized tools and IP that will enable chip designers to build next-generation SoCs based on Arm’s Hercules processor cores...

9 by Anton Shilov on 10/10/2019

TSMC: N7+ EUV Process Technology in High Volume, 6nm (N6) Coming Soon

TSMC announced on Monday that its customers have started shipping products based on chips made by TSMC using its N7+ (2nd Generation 7 nm with EUV) process technology that...

27 by Anton Shilov on 10/8/2019

GlobalFoundries Mulls IPO Plans for 2022

After a decade of being a privately-held contract maker of semiconductors, GlobalFoundries has revealed that it's mulling going public in 2022. The move will help GF’s current owners to...

9 by Anton Shilov on 10/2/2019

TSMC Counter-sues GlobalFoundries: Accuses US Fab of Infringing Patents Across Numerous Process Nodes

In a not-unexpected move, TSMC late on Monday filed a lawsuit against GlobalFoundries, its pure-play foundry rival, accusing the manufacturer of patent infringment. In the suit, a response to...

24 by Anton Shilov on 10/1/2019

Arm & TSMC Showcase 7nm Chiplet, Eight A72 at 4GHz on CoWoS Interposer

Arm and TSMC this week unveiled their jointly developed proof-of-concept chip that combines two quad-core Cortex-72-based 7 nm chiplets on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) interposer. The two chips are connected...

26 by Anton Shilov on 9/27/2019

GlobalFoundries Unveils 12LP+ Technology: Massive Performance & Power Improvements

GlobalFoundries has introduced its 12LP+ fabrication process that relies on the groundwork set by its 14LPP and 12LP technologies and provides significant improvements when it comes to performance, power...

41 by Anton Shilov on 9/25/2019

TSMC Responds to Lawsuit by GlobalFoundries: Allegations Are Baseless

TSMC has responded to GlobalFoundries accusations of patents infringements. The world’s largest foundry said that it would defend itself in courts and that it considered allegations as baseless. The...

62 by Anton Shilov on 8/27/2019

GlobalFoundries Sues TSMC Over Patent Infringement; Apple, Qualcomm, Others Named Defendants

GlobalFoundries has filed a lawsuit against TSMC and its clients in the USA and Germany alleging the world’s largest contract maker of semiconductors of infringing 16 of its patents...

97 by Anton Shilov on 8/26/2019

SMIC: 14nm FinFET in Risk Production; China's First FinFET Line To Contribute Revenue by Late 2019

SMIC, the largest contract maker of semiconductors in China, announced this month that it would start commercial production of chips using its 14 nm FinFET manufacturing technology by the...

53 by Anton Shilov on 8/16/2019

GlobalFoundries Sells Off Photomask Assets to Toppan

Following its decision to focus on specialized process technologies last August, GlobalFoundries has been consolidating its assets as well as selling off businesses and facilities that are not essential...

20 by Anton Shilov on 8/15/2019

Samsung’s Aggressive EUV Plans: 6nm Production in H2, 5nm & 4nm On Track

Samsung Foundry formally started to produce chips using its 7LPP (7 nm low power plus) fabrication process last October and has not slowdown development of its manufacturing technologies since...

42 by Anton Shilov on 7/31/2019

TSMC Announces Performance-Enhanced 7nm & 5nm Process Technologies

TSMC has quietly introduced a performance-enhanced version of its 7 nm DUV (N7) and 5 nm EUV (N5) manufacturing process. The company’s N7P and N5P technologies are designed for...

36 by Anton Shilov on 7/30/2019

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