Samsung
SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The initiative is designed to speed up the adoption of HBM4 memory and solidify SK hynix's and TSMC's leading positions in high-bandwidth memory and advanced processor applications. The primary focus of SK hynix's and TSMC's initial efforts will be to enhance the performance of the HBM4 stack's base die, which (if we put it very simply) acts like an ultra-wide interface between memory devices and host processors. With HBM4, SK hynix plans to use one of TSMC's advanced logic process technologies to build base dies to pack additional features and I/O pins within the confines of existing...
Samsung Shows Off Premium Galaxy Chromebook at CES 2020: 13.3-inch Convertible With 4K AMOLED & More
While sales Chrome OS-powered laptops are continuing to grow, the vast majority of these PCs – and arguably the platform itself – have been positioned as entry-level solutions both...
15 by Anton Shilov on 1/8/2020
Samsung Launches Portable SSD T7 Touch with Fingerprint Security
Samsung's mass-market external drive, the Portable SSD T-series, was last updated in August 2017 with the introduction of the T5 with 64-layer V-NAND. The Portable SSD T5 came with...
8 by Ganesh T S on 1/8/2020
CES 2020: Samsung 980 PRO PCIe 4.0 SSD Makes An Appearance
Samsung's booth at CES 2020 includes our first look at their next flagship consumer SSD, the 980 PRO M.2 NVMe SSD. This would appear to be Samsung's first client/consumer...
55 by Billy Tallis on 1/7/2020
Samsung’s Fab in Hwaseong Suffers Power Outage
Samsung had to stop production of DRAM and V-NAND memory at its fab near Hwaseong, South Korea, due to power outage earlier this week. Damage caused by disruption of...
48 by Anton Shilov on 1/2/2020
AnandTech Year In Review 2019: Solid State Drives
In 2019, flash memory prices have leveled out and have even crept back upward a bit, and new technologies have been slow to roll out, although we are currently...
42 by Billy Tallis on 12/31/2019
AnandTech Year In Review 2019: Flagship Mobile
2019 is coming to an end, and it’s time again to look back at what the industry has brought us. This year, we saw a lot of hardware improvements...
54 by Andrei Frumusanu on 12/26/2019
Japan Partly Removes Restrictions on Photoresists Exports to South Korea
Marking a thawing of relations between the Japanese and South Korean governments, the Japanese Ministry of Economy, Trade and Industry (METI) has partially removed export restrictions on photoresists to...
16 by Anton Shilov on 12/23/2019
Samsung Kicks Off Mass Production of AI Chip for Baidu: 260 TOPS at 150 W
Samsung Foundry and Baidu this week said that the companies were about to start mass production of an AI accelerator chip early in 2020. Baidu’s Kunlun chip is to...
9 by Anton Shilov on 12/18/2019
Samsung to Expand 3D NAND Fab in China
Samsung reportedly plans to invest billions of dollars to expand its 3D NAND production facility in Xian, China. If the company proceeds with the plan, bit production capacity of...
5 by Anton Shilov on 12/17/2019
Samsung Unveils Galaxy A51 & Galaxy A71 Mid-Range Smartphones: 6.5/6.7-Inches With 4-Module Cameras
While Samsung draws most of its smartphone reputation from its high-end phones, the bulk of the phones that the company sells are are not the $700+ Galaxy S series...
22 by Anton Shilov on 12/16/2019
Update: Sales of Samsung Galaxy Fold Are Nowhere Near 1 Million Units
Update 12/14: While claims were earlier made by Samsung's Chief Strategy Officer that the company had sold 1 million Galaxy Folds, the company has since stepped in to correct...
20 by Anton Shilov on 12/12/2019
Samsung to Use SiFive RISC-V Cores for SoCs, Automotive, 5G Applications
At the annual RISC-V Summit this week, Samsung disclosed the use SiFive’s RISC-V cores for upcoming chips for a variety of applications. The company is joining a growing list...
18 by Anton Shilov on 12/12/2019
Fireside Interview on 5G with Cristano Amon and Alex Katouzian, Qualcomm
A little while back, ahead of Qualcomm’s upcoming Tech Summit, we spoke to President of Qualcomm Cristano Amon and SVP/GM of Qualcomm’s Mobile Technologies Alex Katouzian. Qualcomm’s march in...
28 by Dr. Ian Cutress on 12/2/2019
Samsung Develops Intel Lakefield-Based Galaxy Book S: Always-Connected x86 PC
Among several items at its developers conference this week, Samsung revealed that it was working on a version of its always-connected Galaxy Book S laptop powered by Intel’s Lakefield...
29 by Anton Shilov on 10/31/2019
Samsung Launches Galaxy Book Flex: Convertibles with QLED Displays & Ice Lake
In addition to announcing its Galaxy Book Ion notebooks, Samsung this week also introduced its convertible Galaxy Book Flex laptops. Unlike their classic counterparts, the Galaxy Book Flex PCs...
12 by Anton Shilov on 10/30/2019
Samsung Reveals Galaxy Book Ion: Ultralight Laptops w/ QLED Monitor & Comet Lake
Samsung has introduced its new Galaxy Book Ion lineup of laptops that bring together an ultralight weight, an innovative display with quantum dot-enhanced backlighting, and Intel’s 10th Generation Core...
17 by Anton Shilov on 10/30/2019
Samsung Launches Single-Chip uMCP Packages with LPDDR4X DRAM & UFS 3.0 Storage
Samsung has introduced a new lineup of all-in-one memory packages for smartphones that integrate both DRAM and storage. The latest generation of uMCP devices now feature up to 12...
30 by Anton Shilov on 10/24/2019
Samsung Announces Exynos 990: 7nm EUV, M5, G77, LPDDR5 Flagship SoC alongside Exynos 5123 5G Modem
Today Samsung unexpectedly announced the brand new Exynos 990 chipset – likely to be Samsung’s flagship SoC for 2020, employing the newest IP and offering the newest features on...
52 by Andrei Frumusanu on 10/23/2019
Samsung to Invest $11 Billion in QD-OLED Panel Production
Samsung Display has announced plans to invest a further ₩13.1 trillion ($11 billion) in the R&D and production of QD-OLED TV panels. The plan includes building up two QD-OLED...
42 by Anton Shilov on 10/15/2019
Samsung & TSMC Develop 8nm & 7nm Automotive-Grade Nodes
As vehicles are getting ‘smarter’ and gaining autopilot capabilities, it is easy to predict that the demand for higher-performing and more complex automotive SoCs will be growing rapidly in...
29 by Anton Shilov on 10/14/2019
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