IDM 2.0

It’s somewhat of an understatement to say that Intel’s future roadmap on its process node development is one of the most aggressive in the history of semiconductor design. The company is promising to pump out process nodes quicker than we’ve ever seen, despite having gone through a recent development struggle. Even with CEO Pat Gelsinger promising more than ever before, it’s up to Intel’s Technology Development (TD) team to pick up the ball and run with it in innovative ways to make that happen. In charge of it all is Dr. Ann Kelleher, EVP and GM of Intel’s Technology Development, and on the back of some strong announcements last year we reached out for the chance to interview her regarding Intel’s strategy.

Intel Announces Ohio Fab Complex: 2 New Fabs For $20B, And Space For More

With fab expansions on tap across the entire semiconductor industry, Intel today is laying out their own plans for significantly increasing their production capacity by announcing their intention to...

114 by Ryan Smith on 1/21/2022

Bringing Geek Back: Q&A with Intel CEO Pat Gelsinger

One of the overriding key themes of Pat Gelsinger’s ten-month tenure at Intel has been the eponymous will to ‘bring geek back’ to the company, implying a return to...

49 by Dr. Ian Cutress on 10/29/2021

Intel's Process Roadmap to 2025: with 4nm, 3nm, 20A and 18A?!

In today’s Intel Accelerated event, the company is driving a stake into the ground regarding where it wants to be by 2025. CEO Pat Gelsinger earlier this year stated...

326 by Dr. Ian Cutress on 7/26/2021

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