10nm

For the past eighteen months, Intel has paraded its new ‘Lakefield’ processor design around the press and the public as a paragon of new processor innovation. Inside, Intel pairs one of its fast peak performance cores with four of its lower power efficient cores, and uses novel technology in order to build the processor in the smallest footprint it can. The new Lakefield design is a sign that Intel is looking into new processor paradigms, such as hybrid processors with different types of cores, but also different stacking and packaging technologies to help drive the next wave of computing. With this article, we will tell you all you need to know about Lakefield.

Intel: Tiger Lake Client CPUs Coming Mid-Year

Along with detailing the nuts and the bolts of their Q1 2020 earnings, as part of Intel’s financial presentation, the company also offered a quick update on their upcoming...

140 by Ryan Smith on 4/24/2020

SMIC Details Its N+1 Process Technology: 7nm Performance in China

SMIC first started volume production of chips using its 14 nm FinFET fabrication process in Q4 2019. Since then, the company has been hard at work developing its next...

20 by Anton Shilov on 3/23/2020

Intel CFO: Our 10nm Will Be Less Profitable than 22nm [Morgan Stanley Transcription]

This week at Morgan Stanley’s Analyst Conference, Intel’s CFO, George Davis, sat down to discuss the future of where Intel’s profitability lies. No stranger to the odd comments relating...

92 by Dr. Ian Cutress on 3/4/2020

Intel Launches Atom P5900: A 10nm Atom for Radio Access Networks

Continuing Intel’s run of Mobile World Congress-released announcements this morning, the chip maker is also announcing an interesting product in the form of a mobile-related Atom. Dubbed the Atom...

13 by Ryan Smith on 2/24/2020

Intel: 28 W Ice Lake Core i7-1068G7 Coming Q1

One of most frequent questions I’ve had in my personal inbox over the last few weeks has been questioning the existence of the fastest Ice Lake processor. Back when...

186 by Dr. Ian Cutress on 1/10/2020

CES 2020: Lenovo Ducati 5, a Notebook Designed from a Motorbike

Branded hardware isn’t a new concept, and the latest one out of the gate is Lenovo’s new Ducati 5 laptop. Lenovo has partnered with Ducati to combine the styling...

11 by Dr. Ian Cutress on 1/9/2020

Intel at CES 2020: 45W 10th Gen Mobile CPUs Soon, Tiger Lake with Xe Graphics Later

As we move into 2020, there is a lot of talk about what Intel’s 2020 plans will be. Discussions about the expansion of Intel’s 10nm process node products, such...

57 by Dr. Ian Cutress on 1/6/2020

An Interconnected Interview with Intel’s Ramune Nagisetty: A Future with Foveros

I’ve constantly stated for the last two years that the next battleground in performance for the semiconductor market is going to be in the interconnect – whether we’re speaking...

15 by Dr. Ian Cutress on 1/3/2020

AnandTech Year In Review 2019: Lots of CPUs

Throughout 2019, we’ve had quite the reverse of performance when it comes to the competitiveness of the modern performance-oriented desktop processor. This year we’ve seen AMD introduce its Zen...

25 by Dr. Ian Cutress on 12/27/2019

Intel Hires Fab Veteran, Former GlobalFoundries CTO Dr. Gary Patton

Intel has hired Dr. Gary Patton, the former CTO at GlobalFoundries and an ex-head of IBM Microelectronics business. Dr Patton was leading Global Foundries leading edge processes before that...

21 by Anton Shilov on 12/11/2019

Intel’s Manufacturing Roadmap from 2019 to 2029: Back Porting, 7nm, 5nm, 3nm, 2nm, and 1.4 nm

One of the interesting disclosures here at the IEEE International Electron Devices Meeting (IEDM) has been around new and upcoming process node technologies. Almost every session so far this...

138 by Dr. Ian Cutress on 12/11/2019

Intel Publishes Letter to Customers Apologizing for CPU Shipment Delays

In a move that I don’t believe has precedence within the x86 CPU industry, Intel this afternoon has publicly published a letter to its customers and partners apologizing for...

48 by Ryan Smith on 11/20/2019

AnandTech Exclusive: An Interview with Intel’s Raja Koduri about Xe

This week Raja gave the keynote at Intel’s HPC DevCon event, a precursor to Supercomputing, and I did my usual thing of asking for the interview, fully expecting the...

73 by Dr. Ian Cutress on 11/20/2019

Intel Q3 2019 Fab Update: 10nm Product Era Has Begun, 7nm On Track

After years of delays, Intel is finally shipping its 10 nm processors in high volume, and the company is preparing to fire up another fab to produce an even...

59 by Anton Shilov on 10/28/2019

Intel Boosts 14nm Capacity 25% in 2019, But Shortages Will Persist in Q4

Higher-than-expected demand for Intel’s server and PC processors has been an interesting topic of discussion since the middle of 2018, when Intel first informed investors of its backlogged status...

27 by Anton Shilov on 10/25/2019

Intel's new Atom Microarchitecture: The Tremont Core in Lakefield

While Intel has been discussing a lot about its mainstream Core microarchitecture, it can become easy to forget that its lower power Atom designs are still prevalent in many...

101 by Dr. Ian Cutress on 10/24/2019

SK Hynix Develops 16 Gb DDR4 Chips for 32 GB Modules

SK Hynix announced on Monday that it has completed development of its first monolithic 16 Gb chip. This chip is to be made using its 3rd Generation 10 nm-class...

6 by Anton Shilov on 10/22/2019

Intel Supply in Q4: “Output Capacity up, Supply-Demand Still High”

Recent reports from media outlet Digitimes have stated that Intel’s high demand issue, and its inability to fully supply that demand, will continue into Q4. The report states that...

32 by Dr. Ian Cutress on 9/26/2019

Micron: Mass Production of 16 Gb DDR4 & LPDDR4X Chips Using 1z nm Technology

Micron announced on Thursday that it had started volume production of memory chips using its 3rd Generation 10 nm-class fabrication technology (also known as 1Z nm). The first DRAMs...

25 by Anton Shilov on 8/16/2019

Log in

Don't have an account? Sign up now