Update 3/20: Infineon has contacted us and said that the eSIM IC is made using a 40 nm process technology. At MWC this year, Infineon showcased a lineup of its current and embedded SIM products. The company demonstrates not only the industry-standard MFF2 eSIM chip, but also considerably smaller ICs designed for future miniature devices (many of which may not even exist yet as a category) as well as M2M (machine to machine) applications. It is noteworthy that to manufacture an eSIM the size of a match head, Infineon uses GlobalFoundries 14LPP a 40 nm process technology, taking advantage of leading-edge lithography to bring the size of a simple device down. The first SIM cards were introduced in 1991 along with the world’s first GSM network...

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