TSMC on Tuesday announced plans to establish a European Semiconductor Manufacturing Company (ESMC) joint venture with its partners Bosch, Infineon, and NXP to build a fab near Dresden, Germany. The new 300-mm fab will produce chips on TSMC's 28/22 nm and 16/12 nm-class process technologies, primarily for automotive and industrial sectors. As the project is planned under the European Chips Act framework, TSMC is set to get subsidies to build it. The proposed ESMC fab will be located near Dresden, Germany, and is slated to have a monthly production capacity of 40,000 300mm wafer starts per month. The fab is set to use TSMC's 28 nm family of production nodes, which includes several specialty manufacturing technologies and a 22 nm low-power fabrication process with planar...

Hot Chips 2021 Live Blog: New Tech (Infineon, EdgeQ, Samsung)

Welcome to Hot Chips! This is the annual conference all about the latest, greatest, and upcoming big silicon that gets us all excited. Stay tuned during Monday and Tuesday...

3 by Dr. Ian Cutress on 8/23/2021

Infineon Set to Acquire Cypress for $10 Billion

Infineon on Monday said that it had signed an agreement to take over Cypress Semiconductor, strengthening its portfolio of physical interface technologies. The move will add a set of...

2 by Anton Shilov on 6/3/2019

MWC 2019: LG Premiere Press Event, a Live Blog (6:30PM UTC)

LG recently announced that it has a range of new technologies ready for its upcoming ThinQ branded smartphones. We're here at the press event to find out all the details.

16 by Ian Cutress & Andrei Frumusanu on 2/24/2019

Infineon Shows Off Future of eSIM Cards: <1.65 mm2 Made Using 40 nm

Update 3/20: Infineon has contacted us and said that the eSIM IC is made using a 40 nm process technology. At MWC this year, Infineon showcased a lineup of its...

28 by Anton Shilov on 3/11/2017

Log in

Don't have an account? Sign up now